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  • BGA Rework Station - IR860
  • We have engaged in developing, supplying, and manufacturing of BGA Rework Station together. In addition to our existing products, we also accept customized orders for completion. Our products have been going well throughout the domestic market and oversea countries.Therefore, we keep forging ahead and continue to innovate constantly.We wish to establish long-term worldwide business relationships. If you are interested in any of our products, please do not hesitate to contact us.

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    BGA Rework Station

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  • BGA Rework Station
    Model: IR860
    SMD/BGA Rework Station
    Features:
    1. Microcomputer control, warming-up quickly.
    2. The hot air SMD rework station  IR860 is engineered to meet the demanding needs of today's electronic industry, technicians, service / repair and assembly rework. The system not only increase productivity for SMD assembly and repair but achieves a new standard of quality in partnership with "Hot Air IR860" superior performance and ease of operation.
    3. This soldering rework station will highly regulate the air flow and the temperature. Both the welding and the descaling shall be conducted with the same nozzle.
    The auto removal of static electricity offers more safety to the elements and the operation, different ICs would be regulated to different temperatures.
    4. After turning off the power, the auto cooling system remains operational, just to keep the service life of the heating elements and the handle.
    5. It is applicable for galvanized welding and removal of SOP ICs and it is applicable for telescopic hoses.
    Keep the nozzle in use and the element duly spaced, for protection of the elements.
    6. It ensures rapid heating up, accurate and stable temperature control without being affected by the volume of airflow, which really achieves lead-free soldering and desoldering.
    7. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework any size of BGA chips.

    Application:
    Can be realized on a lead, lead-free PCB board components for heating, especially for including BGA, SMD components, PCB board.
     

    Specifications for IR860

    Solderlight Control

    Pre-heater

    Power Rating

    100-120Vac 60 hz

    220-240Vac 50 hz

    Power Rating

    115 vac

    230 vac

    Fuse

    T3.15A (Slow Type)

    T2A (Slow Type)

    Fuse (Delay type)

    T 10 A

    T 5 A

    Output

    15Vac 150W

    Output

    650W

    IR Lamp Temp. range

    45º-450º Celsius (113º-842º Fahrenheit)

    Temperature range

    30º-350º Celsius (86º-662º Fahrenheit)

    Time settings

    0-900sec

    Time settings

    0-900sec

    Size (W*H*D)

    170 x 100 x 200mm
    (6.7" x 3.94" x 7.9")

    Size (W*H*D)

    280 x 90 x 257mm
    (11" x 3.5" x 10")

    Net weight

    7.25 lbs

    Net weight

    7.25 lbs




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