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  • BGA Rework Stations - IR860-II
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  • BGA Rework Stations
    Model: IR860-II
    SMD / BGA Rework Station
    Features:
    1. Compact design,light weight soldering iron and hot air blower meet various soldering demands and remove kinds of chips in repair work.
    2. Best products and factory price.
    3. Time delivery and the shortest delivery time.
    4. Advanced infrared BGA rework station.
    5. With independent preheating function , which can let you preheat pcb bords or bga chips before soldering.
    6. Large power and rapid heating. Temperature can be conveniently adjusted and the temperature is accurate and stable, and not affected by airflow.
    7. Stepless airflow adjusting with a wide range. Temperature can be conveniently adjusted.
    8. Sensitive electromagnetic inductor in handle ensures the unit beginning working immediately so long as the handle is held. When handle is put on the holder, the system will return back to standby mode. Easy to use.

    Application:
    Work great for soldering/desoldering surface mount components in the circuit board of mobile phone. Suitable for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating and glue soldering.
     

    Specifications for IR860

    Solderlight Control

    Pre-heater

    Power Rating

    220-240Vac 50 hz

    Power Rating

    230 vac

    Fuse

    T2A (Slow Type)

    Fuse (Delay type)

    T 5 A

    Output

    15Vac 150W

    Output

    1300W

    IR Lamp Temp. range

    45º-450º Celsius (113º-842º Fahrenheit)

    Temperature range

    30º-350º Celsius (86º-662º Fahrenheit)

    Time settings

    0-900sec

    Time settings

    0-900sec

    Size (W*H*D)

    170 x 100 x 200mm
    (6.7" x 3.94" x 7.9")

    Size (W*H*D)

    402 x 90 x 260mm
    (11" x 3.5" x 10")

    Net weight

    7.25 lbs

    Net weight

    12.81 KGS


      

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